Hunter Operation - Manufacturing Technology Roadmap
The following information is a guideline. If you have special requirements,
please contact Engineering for other available Technologies.
FABRICATION ATTRIBUTES	Standard	Advanced (Production Capable)
Min. Drilled Hole Size (vias)	0.01	0.006
Min. Finished Hole Size (vias)	0.006	0.004
Min. Outer Layer Via Land Size	0.022	0.018
Min. Inner Layer Via Land Size	0.022	0.016
Min. Via Relief on Power/Ground Planes	0.032	0.024
Min. Blind/Buried Via Land Size	0.018	0.016
Min. Blind/Buried Via Hole Size (Drilled)	0.01	0.008
Min Pad Dia over Drill Size	0.01	0.006
Min Anti Pad Over Drill Size	0.02	0.018
Min. Outer Layer Line Width	0.004	0.003
Min. Inner Layer Line Width	0.004	0.003
Min. Outer Layer Line to Line Spacing	0.004	0.003
Min. Inner Layer Line to Line Spacing	0.004	0.003
Min. Line to Via Land Spacing	0.004	0.003
Layer to Layer Registration Tolerance	0.005	0.004
Min/Max Overall Board Thickness	0.004	0.25
Min. Dielectric Thickness:        Standard Cores	0.004	0.003
Buried Via Cores	0.005	0.004
Prepreg	0.0025	0.002
Minimum Soldermask Webbing	0.005	0.0045
Line to SMT Minimum Space	0.004	0.003
Min. Base Copper Weights	0.0007	0.00035
PTH Aspect Ratio	8:01	14:01
Min PTH Tolerance (plus/minus)	0.003	0.002
Coplanarity:
HAL	0.0002	0.0002
Silver	0.00002	0.00002
Gold	0.00003	0.0001
Min SMT Pitch	0.02	0.015
Min Area Array Pitch	.8mm	.75mm
CSP,uBGA Pitch	na	.75mm
Fabrication Radius	0.031	0.016
Warpage	1%	0.75%
Tolerance-Plated Holes	+/- .003	+/- .002
Maximum Layer Count	40
Panel Size	18x24
Surface Finishes	HAL,Ni/AU and Silver
MATERIALS	STANDARD OFFERINGS
All Rogers including  4,5,6000	X
Brass Back/Rogers	X
BT	X
Cyanate Ester	X
FR-4 <170 C Tg (FR406)	X
FR408,Nelco-13,-13 SI	X
GETEK	X
Low Er Epoxy	X
Nelco 6000	X
Polyimide	X
Teflon	X
Thermount	X
FAB TEST	STANDARD	ADVANCED
Electrical Test:                        Continuity (ohms)	20	5
Isolation(Mohms)	10	76
Voltage	100	250
Min Component Pitch	0.02	0.015
Impedance Testing:                       Range (ohms)	40-100	28-150
Tolerance	10%	5%
Differential (up to 175ohms)		yes
Equipment	Universal and Flying Probe
DC resistance Testing	6.5 digit DMM
Propagation Delay	135 to 185 ps/inch Material and Zo Circuit type dependent
ASSEMBLY ATTRIBUTES	STANDARD CAPABILITIES
µBGA, CSP, BGA attach to 45 mm max size	X
Connector and terminal press-fit capability	X
Design Review for Manufacturability	X
Double-side SMT + Thru-hole	X
Fine-pitch SMT, QFP down to 16 mil pitch	X
Flex Circuit Assembly	X
High-speed Pick & Place + Wavesolder	X
Pick & Place 0201 components	X
Quick turn & Prototyping our specialty	X
Rework, Parts Recovery, Rebuild	X
Rohs capabilities	X
Small Parts Assembly and Soldering	X
Water Soluble processes + Aqueous Cleaning	X
ASSEMBLY TEST	STANDARD CAPABILITIES
AOI	X
Flying Probe Test	X
Funtional Test	X
ICT	X
J-Tag	X
DESIGN	STANDARD CAPABILITIES
Cadence Allegro	X
Mentor Pads	X