| Hunter Operation - Manufacturing Technology Roadmap |
| The following information is a guideline. If you have special requirements, |
| please contact Engineering for other available Technologies. |
|
| FABRICATION ATTRIBUTES |
Standard |
Advanced (Production Capable) |
| Min. Drilled Hole Size (vias) |
0.01 |
0.006 |
| Min. Finished Hole Size (vias) |
0.006 |
0.004 |
| Min. Outer Layer Via Land Size |
0.022 |
0.018 |
| Min. Inner Layer Via Land Size |
0.022 |
0.016 |
| Min. Via Relief on Power/Ground Planes |
0.032 |
0.024 |
| Min. Blind/Buried Via Land Size |
0.018 |
0.016 |
| Min. Blind/Buried Via Hole Size (Drilled) |
0.01 |
0.008 |
| Min Pad Dia over Drill Size |
0.01 |
0.006 |
| Min Anti Pad Over Drill Size |
0.02 |
0.018 |
| Min. Outer Layer Line Width |
0.004 |
0.003 |
| Min. Inner Layer Line Width |
0.004 |
0.003 |
| Min. Outer Layer Line to Line Spacing |
0.004 |
0.003 |
| Min. Inner Layer Line to Line Spacing |
0.004 |
0.003 |
| Min. Line to Via Land Spacing |
0.004 |
0.003 |
| Layer to Layer Registration Tolerance |
0.005 |
0.004 |
| Min/Max Overall Board Thickness |
0.004 |
0.25 |
| Min. Dielectric Thickness: Standard Cores |
0.004 |
0.003 |
| Buried Via Cores |
0.005 |
0.004 |
| Prepreg |
0.0025 |
0.002 |
| Minimum Soldermask Webbing |
0.005 |
0.0045 |
| Line to SMT Minimum Space |
0.004 |
0.003 |
| Min. Base Copper Weights |
0.0007 |
0.00035 |
| PTH Aspect Ratio |
8:01 |
14:01 |
| Min PTH Tolerance (plus/minus) |
0.003 |
0.002 |
| Coplanarity: |
|
|
| HAL |
0.0002 |
0.0002 |
| Silver |
0.00002 |
0.00002 |
| Gold |
0.00003 |
0.0001 |
| Min SMT Pitch |
0.02 |
0.015 |
| Min Area Array Pitch |
.8mm |
.75mm |
| CSP,uBGA Pitch |
na |
.75mm |
| Fabrication Radius |
0.031 |
0.016 |
| Warpage |
1% |
0.75% |
| Tolerance-Plated Holes |
+/- .003 |
+/- .002 |
| Maximum Layer Count |
40 |
| Panel Size |
18x24 |
| Surface Finishes |
HAL,Ni/AU and Silver |
| MATERIALS |
STANDARD OFFERINGS |
| All Rogers including 4,5,6000 |
X |
| Brass Back/Rogers |
X |
| BT |
X |
| Cyanate Ester |
X |
| FR-4 <170 C Tg (FR406) |
X |
| FR408,Nelco-13,-13 SI |
X |
| GETEK |
X |
| Low Er Epoxy |
X |
| Nelco 6000 |
X |
| Polyimide |
X |
| Teflon |
X |
| Thermount |
X |
| FAB TEST |
STANDARD |
ADVANCED |
| Electrical Test: Continuity (ohms) |
20 |
5 |
| Isolation(Mohms) |
10 |
76 |
| Voltage |
100 |
250 |
| Min Component Pitch |
0.02 |
0.015 |
| Impedance Testing: Range (ohms) |
40-100 |
28-150 |
| Tolerance |
10% |
5% |
| Differential (up to 175ohms) |
|
yes |
| Equipment |
Universal and Flying Probe |
| DC resistance Testing |
6.5 digit DMM |
| Propagation Delay |
135 to 185 ps/inch Material and Zo Circuit type dependent |
| |
|
|
| ASSEMBLY ATTRIBUTES |
STANDARD CAPABILITIES |
| µBGA, CSP, BGA attach to 45 mm max size |
X |
| Connector and terminal press-fit capability |
X |
| Design Review for Manufacturability |
X |
| Double-side SMT + Thru-hole |
X |
| Fine-pitch SMT, QFP down to 16 mil pitch |
X |
| Flex Circuit Assembly |
X |
| High-speed Pick & Place + Wavesolder |
X |
| Pick & Place 0201 components |
X |
| Quick turn & Prototyping our specialty |
X |
| Rework, Parts Recovery, Rebuild |
X |
| Rohs capabilities |
X |
| Small Parts Assembly and Soldering |
X |
| Water Soluble processes + Aqueous Cleaning |
X |
| ASSEMBLY TEST |
STANDARD CAPABILITIES |
| AOI |
X |
| Flying Probe Test |
X |
| Funtional Test |
X |
| ICT |
X |
| J-Tag |
X |
|
|
| DESIGN |
STANDARD CAPABILITIES |
| Cadence Allegro |
X |
| Mentor Pads |
X |
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