Hunter Technology is committed at all levels to delivering products and services of the highest quality that address our customers' current and future requirements. As a manufacturer of complex products, Hunter's 200+ employees understand how to manage all aspects of your project including: design, fabrication, parts procurement, assembly, box build, and test.

 

Standard Services: 

• Supply Chain Management
• MRP / Bar Code Scanning
• Customer Warehousing: Parts and Finished Goods Inventory
• Each Order is reviewed by Process Engineer, QA Manager, Production Manager, Planning, Materials, Purchasing, and Program Manager
• Build quantities of 50 to 5000
• Controlled Finished Goods Area for JIT & Kanban Requirements

 

Experienced Team Of Professionals: 

• Purchasing Team: Purchase by commodity expertise through major distributors and a network of industry contacts.
• Materials Staff: Responsible for customer based warehouse, materials transfers, and common parts warehouse.
• Planning Group: Manage Document Control, ECO's, and WIP planning.
• Program Management Team: Customer's Single Source Interface with Production.

 

Requirements For Assembly & Turnkey: 

• Assembly Drawing with complete notes and Revision Level
• Bill of Material with reference locations and Revision Level
• Special Instructions for rework
• Gerber File with Revision Level
• Complete CAD File in ASCII format with Revision Level
• BOM on floppy disk with Revision Level (Excel format preferred)

 

Hunter Technology's extensive PCB engineering experience can help compress the development cycle of your product, enhance performance, and reduce cost.

Fabrication Services
• Quick Turnaround; 24 Hours to 3 Days Based on Complexity
• Thermal Management Solutions
• Valor Genesis Design Rule Check (DRC)
• Gerber to CAD Netlist Comparison
• Prototype to Production Quantities and Virtual Manufacturing
• Net List Testing: Flying Probe and Bed of Nails
• TDR Testing for Impedance: Single Ended & Differential Pairs
• Engineering Support Services for Impedance Modeling, SI, and Fabrication
• Design Rules
• Layer Stack-Up and Special Materials Consulting
• Large Format Custom Backplanes
 

Capabilities
• 2 to 44 Layers
• Impedance Modeling and Layer Stack Up Generation
• Controlled Impedance: Zo, Zd and Rambus
• Trace Widths Down to 3 mils, Spacing Down to 3 mils
• Blind & Buried Vias and Microvias
• Materials: FR4, STABLCOR, Teflon, BI, BT, Polyimide, Duroid, Thermount,
   Rogers (All Materials),
• High Temp Epoxy, and Low Loss Epoxy (FR408, N4000-13 & -13SI, N6000SI)
• Composite Boards: High Speed Material (Teflon)/ FR4 Combined Materials
• Gold Body (Hard and Wire Bondable), Ni/Pd/Au, Entek, HASL Surface Finishes
• BGA, Micro BGA, COB, SMT, PTH, & Edge Plating
• Heatsinks, Metal Core, Cu/In/Cu, Cu/Mo/Cu
 
Quality
• ISO 9001 and 9002 Certified
• Mil-PRF-55110 F Certified
• UL Certified