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Hunter Technology's extensive PCB engineering experience can help compress the development cycle of your product, enhance performance & reliability, and reduce cost and lead time. The Hunter Technology manufacturing campus is focused on: Medical, Hi-Rel Technology, Industrial, Test & Measurement and Defense/Military products.
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Fabrication Services - Quick Turnaround; 24 Hours to 3 Days Based on Complexity
- Thermal Management Solutions
- Valor Genesis Design Rule Check (DRC)
- Gerber to CAD Netlist Comparison
- Net List Testing: Flying Probe and Bed of Nails
- TDR Testing for Impedance: Single Ended & Differential Pairs
- Engineering Support Services for Impedance Modeling, SI, and Fabrication
- Layer Stack-Up and Special Materials Consulting
- Large Format Custom Backplanes
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Capabilities - 2 to 44 Layers
- Impedance Modeling and Layer Stack Up Generation
- Controlled Impedance: Zo, Zd and Rambus
- Trace Widths Down to 3 mils, Spacing Down to 3 mils
- Blind & Buried Vias and Microvias
- Materials: FR4, STABLCOR, Teflon, BI, BT, Polyimide, Duroid, Thermount, Rogers (All Materials)
- High Temp Epoxy, and Low Loss Epoxy (FR408, N4000-13 & -13SI, N6000SI)
- Composite Boards: High Speed Material (Teflon)/ FR4 Combined Materials
- Gold Body (Hard and Wire Bondable), Ni/Pd/Au, Entek, HASL Surface Finishes
- BGA, Micro BGA, COB, SMT, PTH, & Edge Plating
- Heatsinks, Metal Core, Cu/In/Cu, Cu/Mo/Cu
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